Contact Plating  

Tin

Mounting Type  

Surface Mount

Package / Case  

12-WFQFN Exposed Pad, CSP

Surface Mount  

YES

Number of Pins  

12

Number of Elements  

1

Operating Temperature  

-40°C~125°C

Packaging  

Tape & Reel (TR)

JESD-609 Code  

e3

Pbfree Code  

no

Part Status  

Discontinued

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

12

Termination  

SMD/SMT

ECCN Code  

EAR99

Type  

with Latch

Max Power Dissipation  

6mW

Terminal Position  

QUAD

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.5mm

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

ADCMP603

Pin Count  

12

Qualification Status  

Not Qualified

Output Type  

CMOS, Complementary, Rail-to-Rail, TTL

Power Supplies  

3/5V

Nominal Supply Current  

3.6mA

Power Dissipation  

6mW

Output Current  

50mA

Propagation Delay  

5 ns

Quiescent Current  

1.8mA

Response Time  

5000 ns

Common Mode Rejection Ratio  

50 dB

Voltage - Supply, Single/Dual (±)  

2.5V~5.5V

Input Offset Voltage (Vos)  

5mV

Voltage Gain  

85dB

Power Supply Rejection Ratio (PSRR)  

50dB

Supply Voltage Limit-Max  

5.5V

Max Input Current  

5μA

Input Bias Current  

5μA

Current - Quiescent (Max)  

1.8mA

Voltage - Input Offset (Max)  

5mV @ 2.5V

Current - Input Bias (Max)  

5μA @ 2.5V

Hysteresis  

100μV

CMRR, PSRR (Typ)  

50dB CMRR, 50dB PSRR

Length  

3mm

Width  

3mm

REACH SVHC  

No SVHC

RoHS Status  

ROHS3 Compliant

Lead Free  

Contains Lead